Report Highlights
The global market for semiconductor silicon wafers is expected to grow from $14.6 billion in 2025 and is projected to reach $20.2 billion by the end of 2030, at a compound annual growth rate (CAGR) of 6.7% during the forecast period of 2025 to 2030.
Report Includes
- 45 data tables and 55 additional tables
- An analysis of the global market for semiconductor silicon wafers
- Analyses of the global market trends, with revenue data for 2024, estimates for 2025, forecasts for 2026, 2028, and projections of CAGRs through 2030
- Estimates of the market’s size and revenue growth prospects, accompanied by a market share analysis by crystal growth method, wafer size, wafer-bonding methods, end users, and region
- Facts and figures pertaining to market dynamics, technological advances, regulations, prospects, and the impacts of macroeconomic variables
- Insights derived from Porter’s Five Forces model, as well as an industry value chain analysis
- Emerging technologies and new developments in silicon wafers, as well as an evaluation of recent patent activity featuring key granted and published patents
- Overview of sustainability trends and ESG developments, with emphasis on consumer attitudes, as well as the ESG risk ratings and practices of leading companies
- Analysis of the industry structure, including companies’ market shares and rankings, strategic alliances, M&A activity and a venture funding outlook
- Profiles of the leading companies in the market, including Shin-Etsu Chemical Co. Ltd., Siltronic AG, GlobalWafers Co. Ltd., SUMCO Corp., and SK Siltron Co. Ltd.
Report Scope
This report analyzes the semiconductor silicon wafer market across multiple segments, including crystal growth methods, wafer size, wafer-bonding methods and end users, offering insights into key trends and growth drivers. The study focuses on crystal growth methods such as Czochralski (CZ), Bridgman and float zone (FZ). It assesses the adoption of methods across different wafers sizes, including 300 mm, 200 mm, 100 mm and others. The report evaluates market demand across key wafer bonding methods segments, namely direct bonding, surface-activated bonding, anodic bonding and plasma bonding. In addition, the report is analyzed across the end users segments: IT and telecommunication, healthcare, aerospace and defense, industrial, consumer electronics, automotive and others.
The report also provides a comprehensive regional analysis covering North America, Europe, Asia-Pacific and the Rest of the World. It evaluates the drivers, challenges and emerging trends, while highlighting innovations in material design and performance enhancement. The study concludes with an analysis of major market companies and their offerings. The base year for the study is 2024, with projections for the years 2025 through 2030, including the compound annual growth rate (CAGR) for the forecast period.
Report Synopsis
| Report Metrics | Details | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Base year considered | 2024 | ||||||||||||||||
| Forecast period considered | 2025-2030 | ||||||||||||||||
| Base year market size | $13.8 Billion | ||||||||||||||||
| Market size forecast | $20.2 Billion | ||||||||||||||||
| Growth rate | CAGR of 6.7% for the forecast period of 2025-2030 | ||||||||||||||||
| Units considered | $ Millions | ||||||||||||||||
| Segments covered | Crystal Growth Methods, Wafer Size, Wafer-Bonding Methods, End Users, Region | ||||||||||||||||
| Regions covered | North America, Europe, Asia-Pacific, and Rest of the World | ||||||||||||||||
| Countries covered | U.S., Canada, Germany, France, the U.K., Italy, Spain, China, India, Taiwan, Japan, South Korea, Latin America, and MEA | ||||||||||||||||
| Key Market Drivers |
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| Companies studied |
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Analyst Credentials
BCC Research Team possesses expertise and experience in life and physical science domains. They specialize in offering valuable business insights, including industry analysis, competitor intelligence, strategic and financial analysis, and opportunity assessment. The team has in-depth knowledge of various sectors, including healthcare, biotechnology, pharmaceuticals, IT, automation, advanced materials, and energy. They are proficient in qualitative and quantitative market intelligence providing clients with actionable insights. With a vast understanding of the competitive landscape, the team can support clients in making data-driven decisions to help them achieve a competitive edge in their respective markets.
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Report Highlights
The global market for semiconductor wafers should grow from $16.2 billion in 2018 to $21.3 billion by 2023 with a compound annual growth rate (CAGR) of 5.7% for the period of 2018-2023.
Report Includes
- 72 data tables and 10 additional tables
- An overview of the global markets for semiconductor silicon wafers
- Analyses of global market trends, with data from 2017, 2018, and projections of compound annual growth rates (CAGRs) through 2023
- Identification of potential applications of semiconductor silicon wafers in consumer electronics, telecommunications, automotive, defence, and healthcare industry
- Overview of various bonding technologies in the semiconductor silicon wafers industry, including direct bonding, surface activated bonding, plasma activated bonding and anodic bonding
- Coverage of major innovation initiatives in silicon wafer fabrication technology
- Detailed analysis of major vendors and suppliers of the industry, including 3M, Global Wafers Co., Ltd., Mechatronik Systemtechnik GmbH, Nissan Chemical Corporation, Samsung, Shanghai Simgui Technology, Toshiba and Wafer World Inc
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