Report Highlights

The global market for flip-chip technology totaled $24.9 billion in 2015. The market should total $27.2 billion and $41.4 billion in 2016 and 2021 respectively, increasing at a compound annual growth rate (CAGR) of 8.8% from 2016 to 2021.

Report Includes

• An overview of the global markets for flip-chip technologies, a process to interconnect IC’s and other microelectronics devices (MEMS) to the external circuitry by means of a solder bumping process deposit on pads.
• Analyses of global market trends, with data from 2015, 2016, and projections of compound annual growth rates (CAGRs) through 2021.
• Discussion of the evolution, architecture, and value chain of flip-chip technologies.
• Examination of market dynamics, including drivers, restraints, and opportunities.
• Analysis of the flip-chip assembly markets by geography, including North America, Europe, Asia-Pacific, and others.
• Coverage of the competitive landscape, including mergers and acquisitions, collaborations and agreements, and new product development.
• Profiles of major players in the industry.

Report Scope

The market for flip-chip technology is segmented by the following categories:

• Wafer bumping process.
• Copper (Cu) pillar. 
• Lead (Pb)-free solder. 
• Tin-lead (Sn-Pb) eutectic solder. 
• Gold stud + plated solder.
• Application area.
• 2-D logic system-on-a-chip (SoC).
• Memory. 
• Imaging, high-brightness light-emitting diode (HB-LED) small logic. 
• Radio-frequency (RF), power, analog, and mixed-signal integrated circuits (ICs). 
• µ-bumping for 2.5-D/3-D system-in-package/system-on-a-chip (SiP/SoC).
• End use.
• Smartphones. 
• Laptops. 
• Desktop CPUs. 
• Graphics processing units (GPUs) and chipsets. 
• Other computing devices. 
• Automotive. 
• Robotics. 
• Medical devices. 
• Smart technologies. 
• High-performance/industrial applications.
• Region.
• North America (the U.S., Canada and Mexico).
• Europe (Italy, France, Germany, U.K., and other countries). 
• Asia-Pacific (China, Japan, Taiwan, South Korea, India. and other countries). 
• ROW (Middle East and Africa).

This report also provides a competitive analysis of the industry, a patent analysis, and a chapter including company profiles. All estimated values used are based on manufacturers’ total revenues, and are given in current U.S. dollars, unadjusted for inflation.

Analyst Credentials

Sinha G. Gaurav, research analyst, holds an MBA in finance from ICFAI Business School, Hyderabad (India), and a bachelor's degree in electrical engineering from Rajasthan University (India). He has worked in almost all domains across the market research industry. He has 11 years of experience in the fields of market research and investment banking. His primary focus is in healthcare, chemicals, electronics, finance and database designing. His publications include subjects such as quantum dots, IT in healthcare, alternative data, ultrafast lasers, inorganic polymers, waste management, factory automation and Voxel, among others.