Taiwan Semiconductor Manufacturing Co. Ltd.

TSMC's SoIC services offer a comprehensive range of semiconductor manufacturing solutions, including custom fabrication of memory chips, wafers and integrated circuits, as well as research, design, testing and technology consulting services. SoIC is a crucial technology for advancing heterogeneous chiplet integration, enabling smaller, higher-performance chips. Its ultra-high-density vertical stacking technology ensures high performance, low power consumption and minimal resistance-inductance-capacitance. By combining active and passive chips into a new integrated SoC system, SoIC achieves a better form factor and performance while maintaining electrical compatibility with traditional SoCs.

TSMC's 3DFabric for HPC offers a comprehensive solution for homogeneous and heterogeneous integration, from design to manufacturing. This application-specific platform utilizes TSMC's advanced wafer technology, design ecosystem and 3DFabric technology to enable rapid upgrades and faster product development. The frontend 3D stacking technology, TSMC-SoIC, provides flexibility in designing and integrating chiplets at the chip level.

The CoWoS platform is a wafer-level system integration platform that delivers exceptional performance and high integration density for high-performance computing applications. It offers a wide range of options for interposer sizes, the number of HBM cubes and package sizes. CoWoS can accommodate interposers larger than twice the size of a reticle (~1,700 mm2), allowing for the integration of advanced SoC chips with more than four HBM2/HBM2E cubes.